Wälchli, R. Brunschwiler, T. Michel, B. Poulikakos, D. 2010 <jats:p>A self-contained, small-volume liquid cooling system for thin form-factor electronic equipment (e.g., blade server modules) is demonstrated experimentally in this paper. A reciprocating water flow loop absorbs heat using mesh-type microchannel cold plates and spreads it periodically to a larger area. From there, the thermal energy is interchanged via large area, low pressure drop cold plates with a secondary heat transfer loop (air or liquid). Four phase-shifted piston pumps create either a linearly or radially oscillating fluid flow in the frequency range of 0.5–3 Hz. The tidal displacement of the pumps covers 42–120% of the fluid volume, and, therefore, an average flow rate range of 100–800 ml/min is tested. Three different absorber mesh designs are tested. Thermal and fluidic characteristics are presented in a time-resolved and a time-averaged manner. For a fluid pump power of 1 W, a waste heat flux of 180 W/cm2(ΔT=67 K) could be dissipated from a 3.5 cm2 chip. A linear oscillation flow pattern is advantageous over a radial one because of the more efficient heat removal from the chip and lower hydraulic losses. The optimum microchannel mesh density is determined as a combination of low pump losses and high heat transfer rates.</jats:p> https://sonar.ch/global/documents/140210 eng info:eu-repo/semantics/altIdentifier/doi/10.1115/1.4000456 info:eu-repo/semantics/altIdentifier/issn/0022-1481 Journal of Heat Transfer. - ASME International. - 2010, vol. 132, no. 5 Mechanical Engineering General Materials Science Mechanics of Materials Condensed Matter Physics Self-Contained, Oscillating Flow Liquid Cooling System for Thin Form Factor High Performance Electronics http://purl.org/coar/resource_type/c_6501