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Author Correction: Record thermopower found in an IrMn-based spintronic stack.

  • Tu S Fert Beijing Institute, BDBC, School of Microelectronics, Beihang University, 100191, Beijing, China.
  • Ziman T Institut Laue-Langevin, 38042, Grenoble, France.
  • Yu G Department of Electrical Engineering, University of California, Los Angeles, CA, 90095, USA.
  • Wan C Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, University of Chinese Academy of Sciences, Chinese Academy of Sciences, 100190, Beijing, China.
  • Hu J Fert Beijing Institute, BDBC, School of Microelectronics, Beihang University, 100191, Beijing, China.
  • Wu H Department of Electrical Engineering, University of California, Los Angeles, CA, 90095, USA.
  • Wang H Fert Beijing Institute, BDBC, School of Microelectronics, Beihang University, 100191, Beijing, China.
  • Liu M Electron Microscopy Laboratory, School of Physics, Peking University, 100871, Beijing, China.
  • Liu C Fert Beijing Institute, BDBC, School of Microelectronics, Beihang University, 100191, Beijing, China.
  • Guo C Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, University of Chinese Academy of Sciences, Chinese Academy of Sciences, 100190, Beijing, China.
  • Zhang J Fert Beijing Institute, BDBC, School of Microelectronics, Beihang University, 100191, Beijing, China.
  • Cabero Z MA Fert Beijing Institute, BDBC, School of Microelectronics, Beihang University, 100191, Beijing, China.
  • Zhang Y Fert Beijing Institute, BDBC, School of Microelectronics, Beihang University, 100191, Beijing, China.
  • Gao P Electron Microscopy Laboratory, School of Physics, Peking University, 100871, Beijing, China.
  • Liu S Shenzhen Institute for Quantum Science and Engineering (SIQSE), and Department of Physics, Southern University of Science and Technology (SUSTech), 518055, Shenzhen, China.
  • Yu D Electron Microscopy Laboratory, School of Physics, Peking University, 100871, Beijing, China.
  • Han X Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, University of Chinese Academy of Sciences, Chinese Academy of Sciences, 100190, Beijing, China.
  • Hallsteinsen I Department of Electronic Systems, Norwegian University of Science and Technology, Trondheim, 7491, Norway.
  • Gilbert DA Material Science and Engineering Department, University of Tennessee, Knoxville, TN, 37996, USA.
  • Matsuo M Kavli Institute for Theoretical Sciences, University of Chinese Academy of Sciences, 100190, Beijing, China.
  • Ohnuma Y Kavli Institute for Theoretical Sciences, University of Chinese Academy of Sciences, 100190, Beijing, China.
  • Wölfle P Institute for Theory of Condensed Matter, Karlsruhe Institute of Technology, 76049, Karlsruhe, Germany.
  • Wang KL Department of Electrical Engineering, University of California, Los Angeles, CA, 90095, USA.
  • Ansermet JP Institute of Physics, Ecole Polytechnique Fédérale de Lausanne (EPFL), 1015, Lausanne, Switzerland.
  • Maekawa S Kavli Institute for Theoretical Sciences, University of Chinese Academy of Sciences, 100190, Beijing, China.
  • Yu H Fert Beijing Institute, BDBC, School of Microelectronics, Beihang University, 100191, Beijing, China. haiming.yu@buaa.edu.cn.
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  • 2020-05-16
Published in:
  • Nature communications. - 2020
English An amendment to this paper has been published and can be accessed via a link at the top of the paper.
Language
  • English
Open access status
gold
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Persistent URL
https://sonar.ch/global/documents/150971
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