Journal article
Fabrication and characterization of three-dimensional InGaAs/GaAs nanosprings.
English
This paper presents the use of a novel fabrication technique to produce three-dimensional (3D) nanostructures. The process is based on conventional microfabrication techniques to create a planar pattern in an InGaAs/GaAs bilayer that self-assembles into 3D structures during a wet etch release. The nanostructures are proposed to function as nanosprings for electromechanical sensors. Nanomanipulation inside a scanning electron microscope (SEM) was conducted to probe the structures for mechanical characterization. The results were validated by simulation.
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closed
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https://sonar.ch/global/documents/185224
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